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FOUNDRY PROCESS QUALIFICATION GUIDELINES (Wafer Fabrication Manufacturing Sites)
Pages: 48
Publication date: 2014-02-01
PROCEDURE FOR WAFER-LEVEL-TESTING OF THIN DIELECTRICS
Pages: 47
Publication date: 2010-03-01
ISOTHERMAL ELECTROMIGRATION TEST PROCEDURE
Pages: 49
Publication date: 2007-10-01
METHOD FOR CHARACTERIZING THE ELECTROMIGRATION FAILURE TIME DISTRIBUTION OF INTERCONNECTS UNDER CONSTANT-CURRENT AND TEMPERATURE STRESS
Pages: 37
Publication date: 2006-03-01
A PROCEDURE FOR MEASURING P-CHANNEL MOSFET NEGATIVE BIAS TEMPERATURE INSTABILITIES
Pages: 19
Publication date: 2004-11-01
A PROCEDURE FOR MEASURING P-CHANNEL MOSFET HOT-CARRIER-INDUCED DEGRADATION AT MAXIMUM GATE CURRENT UNDER DC STRESS
Pages: 24
Publication date: 2004-09-01
Publication date: 2004-05-01
STANDARD METHOD FOR MEASURING AND USING THE TEMPERATURE COEFFICIENT OF RESISTANCE TO DETERMINE THE TEMPERATURE OF A METALLIZATION LINE
Pages: 38
Publication date: 2004-02-01
PROCEDURE FOR CHARACTERIZING TIME-DEPENDENT DIELECTRIC BREAKDOWN OF ULTRA-THIN GATE DIELECTRICS
Pages: 32
Publication date: 2003-08-01
A PROCEDURE FOR EXECUTING SWEAT
