IPC-2223E used in conjunction with IPC-2221, IPC-2223 establishes the specific requirements for the design of flexible printed boards and forms of component mounting and interconnecting structures. The flexible materials used in the structures are comprised of insulating films, reinforced and/or non-reinforced dielectric in combination with metallic materials. IPC-2223E provides new design guidance and requirements for fabrication drawings, hole to edge spacing, bend area conductor considerations, dielectric thickness between rigid and flexible regions and dual row zero insertion force (ZIF) connectors.
Document identifier
IPC 2223E
Title
Sectional Design Standard for Flexible/Rigid-Flexible Printed Boards
IPC Category
General, Design, DoD Adopted, PCBs
Publication date
2020-01-24
International Relationship
History of version
IPC 2223E * IPC 2223D * IPC 2223C * IPC 2223B * IPC 2223A
| Price |
168 vnd |
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