IPC-2226A, Sectional Design Standards for High Density Interconnect (HDI) Printed Boards is used in conjunction with IPC-2221B. The IPC-2226A standard establishes requirements and considerations for the design of high density interconnect (HDI) printed boards and microvia technology. Revision A constitutes a substantial update to the document, with an all new color key for HDI constructions, new coverage of routing density factors and a complete rebuild of feature size recommendations, including aspect ratio, capture and target land sizes. Almost every graphic in Sections 3, 5 and 9 has been revised and/or supplemented with new graphics addressing various microvia formation processes and HDI constructions.
Document identifier
IPC 2226A
Title
Sectional Design Standard for High Density Interconnect (HDI) Printed Boards
IPC Category
General, Design, DoD Adopted, PCBs
Publication date
2017-09-01
International Relationship
History of version
IPC 2226A * IPC 2226
| Price |
168 vnd |
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