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JEDEC JESD22-B113B

BOARD LEVEL CYCLIC BEND TEST METHOD FOR INTERCONNECT RELIABILITY CHARACTERIZATION OF SMT ICS FOR HANDHELD ELECTRONIC PRODUCTS

Pages: 26
Publication date: 2018-08-01
Price: 67 vnd

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The Board Level Cyclic Bend Test Method is intended to evaluate and compare the performance of surface mount electronic components in an accelerated test environment for handheld electronic products applications. The purpose is to standardize the test methodology to provide a reproducible performance assessment of surface mounted components while duplicating the failure modes normally observed during product level test. This is not a component qualification test and is not meant to replace any product level test that may be needed to qualify a specific product and assembly.
Document identifier
JEDEC JESD22-B113B
Title
BOARD LEVEL CYCLIC BEND TEST METHOD FOR INTERCONNECT RELIABILITY CHARACTERIZATION OF SMT ICS FOR HANDHELD ELECTRONIC PRODUCTS
JEDEC Category
JC-14.1: Reliability Test Methods for Packaged Devices
Publication date
2018-08-01
Status
Effective
International Relationship
Cross references
Latest version
JEDEC JESD22-B113B
BOARD LEVEL CYCLIC BEND TEST METHOD FOR INTERCONNECT RELIABILITY CHARACTERIZATION OF SMT ICS FOR HANDHELD ELECTRONIC PRODUCTS
Document identifier JEDEC JESD22-B113B
Publication date 2018-08-01
Classification
Status Effective
*
History of version
JEDEC JESD22-B113B * JEDEC JESD22-B113
Keywords
Classification
Pages
26
Price 67 vnd

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