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JEDEC JESD22-A111B

EVALUATION PROCEDURE FOR DETERMINING CAPABILITY TO BOTTOM SIDE BOARD ATTACH BY FULL BODY SOLDER IMMERSION OF SMALL SURFACE MOUNT SOLID STATE DEVICES

Pages: 22
Publication date: 2018-03-01
Price: 62 vnd

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The purpose of this test method is to identify the potential wave solder classification level of small plastic Surface Mount Devices (SMDs) that are sensitive to moisture-induced stress so that they can be properly packaged, stored, and handled to avoid subsequent mechanical damage during the assembly wave solder attachment and/or repair operations. This test method also provides a reliability preconditioning sequence for small SMDs that are wave soldered using full body immersion. This test method, may be used by users to determine what classification level should be used for initial board level reliability qualification.
Document identifier
JEDEC JESD22-A111B
Title
EVALUATION PROCEDURE FOR DETERMINING CAPABILITY TO BOTTOM SIDE BOARD ATTACH BY FULL BODY SOLDER IMMERSION OF SMALL SURFACE MOUNT SOLID STATE DEVICES
JEDEC Category
JC-14.1: Reliability Test Methods for Packaged Devices
Publication date
2018-03-01
Status
Effective
International Relationship
Cross references
Latest version
JEDEC JESD22-A111B
EVALUATION PROCEDURE FOR DETERMINING CAPABILITY TO BOTTOM SIDE BOARD ATTACH BY FULL BODY SOLDER IMMERSION OF SMALL SURFACE MOUNT SOLID STATE DEVICES
Document identifier JEDEC JESD22-A111B
Publication date 2018-03-01
Classification
Status Effective
*
History of version
JEDEC JESD22-A111B * JEDEC JESD22-A111A * JEDEC JESD 22-A111
Keywords
Classification
Pages
22
Price 62 vnd

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