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Mechanical standardization of semiconductor devices - Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA)
Pages: 36
Publication date: 2016-09-27
Price: 117 vnd
Mechanical standardization of semiconductor devices - Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA) | |
Document identifier | IEC 60191-6-13 Ed. 2.0 b:2016 |
Publication date | 2016-09-27 |
Classification | 31.080.01. Semiconductor devices in general |
Status | Effective |