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IEC 60191-6-13 Ed. 2.0 b:2016

Mechanical standardization of semiconductor devices - Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA)

Pages: 36
Publication date: 2016-09-27
Price: 117 vnd

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IEC 60191-6-13:2016 specifies a design guideline of open-top-type semiconductor sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA). In particular, this part of IEC 60191 establishes the outline drawings and dimensions of the open-top-type test and burn-in sockets applied to FBGA and FLGA. This edition includes the following significant technical changes with respect to the previous edition: a) BGA package nominal length and width have been newly expanded to 43 mm and 43 mm, respectively. Accordingly, six socket sizes have been added to the socket group numbers 1, 2 and 3, and twenty-two socket sizes have been added to the socket group number 4.
Document identifier
IEC 60191-6-13 Ed. 2.0 b:2016
Title
Mechanical standardization of semiconductor devices - Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA)
IEC Category
SC 47D: Mechanical standardization for semiconductor devices
Publication date
2016-09-27
Status
Effective
International Relationship
Cross references
Latest version
IEC 60191-6-13 Ed. 2.0 b:2016
Mechanical standardization of semiconductor devices - Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA)
Document identifier IEC 60191-6-13 Ed. 2.0 b:2016
Publication date 2016-09-27
Classification 31.080.01. Semiconductor devices in general
Status Effective
*
History of version
IEC 60191-6-13 Ed. 2.0 b:2016 * IEC 60191-6-13 Ed. 1.0 b:2007 * IEC 60191-6-13 Ed. 1.0 en:2007
Keywords
Pages
36
Price 117 vnd