The purpose of this JEDEC standard is to verify the workmanship and requirements of microelectronic packages and covers (lids) intended for use in fabricating hybrid microelectronic circuits/microcircuits (hereafter referred to as ?microcircuits?). It is applicable for use by the package manufacturer (i.e., package components), and the microcircuit manufacturer (i.e., from incoming inspection of package components through final inspection of the completed microcircuit). This standard also encompasses and replaces JESD27, Ceramic Package Specification for Microelectronic Packages. It is meant to be used in conjunction, and to not contradict, with MIL-STD-883, Test Method 2009: External Visual.
Document identifier
JEDEC JESD9C
Title
Inspection Criteria for Microelectronic Packages and Covers
JEDEC Category
JC-13.5: Hybrid, RF/Microwave, and MCM Technology
Publication date
2017-05-01
International Relationship
History of version
JEDEC JESD9C * JEDEC JESD9B * JEDEC JESD 9-A
| Price |
141 vnd |
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