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JEDEC JESD 9-A

METAL PACKAGE SPECIFICATION FOR MICROELECTRONIC PACKAGES AND COVERS

Pages: 55
Publication date: 1987-04-01
Price: 91 vnd

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This standard establishes the general requirements and quality assurance provisions that can be specified and met in procuring microelectronics packages and covers, manufactured from matched seal with and without high thermal conductivity base materials, intended for use in fabricating hybrid microelectronics circuits. This document details those minimum requirements necessary for metal packages' use exclusively.
Document identifier
JEDEC JESD 9-A
Title
METAL PACKAGE SPECIFICATION FOR MICROELECTRONIC PACKAGES AND COVERS
JEDEC Category
JC-13.5: Hybrid, RF/Microwave, and MCM Technology
Publication date
1987-04-01
Status
Ineffective
International Relationship
Cross references
Latest version
JEDEC JESD9C
Inspection Criteria for Microelectronic Packages and Covers
Document identifier JEDEC JESD9C
Publication date 2017-05-01
Classification
Status Effective
*
History of version
JEDEC JESD9C*JEDEC JESD 9-A * JEDEC JESD9C * JEDEC JESD9B * JEDEC JESD 9-A
Keywords
Classification
Pages
55
Price 91 vnd

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