The power and temperature cycling test is performed to determine the ability of a device to withstand alternate exposures at high and low temperature extremes and simultaneously the operating biases are periodically applied and removed. It is intended to simulate worst case conditions encountered in application environments. The power and temperature cycling test is considered destructive and is only intended for device qualification. This test method applies to semiconductor devices that are subjected to temperature excursions and required to power on and off during all temperatures.
Document identifier
JEDEC JESD22-A105D
Title
POWER AND TEMPERATURE CYCLING
JEDEC Category
JC-14.1: Reliability Test Methods for Packaged Devices
Publication date
2020-01-01
International Relationship
History of version
JEDEC JESD22-A105D * JEDEC JESD22-A105C (R2011)
| Price |
53 vnd |
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