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IEC 61191-3 Ed. 2.0 b:2017

Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies

Pages: 40
Publication date: 2017-05-30
Price: 117 vnd

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IEC 61191-3:2017 prescribes requirements for lead and hole solder assemblies. The requirements pertain to those assemblies that totally use through-hole mounting technology (THT), or the THT portions of those assemblies that include other related technologies (i.e.. surface mount, chip mounting, terminal mounting).This edition includes the following significant technical changes with respect to the previous edition:a) The requirements have been updated to be compliant wit the acceptance criteria in IPC-A-610F.
Document identifier
IEC 61191-3 Ed. 2.0 b:2017
Title
Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies
IEC Category
TC 91: Electronics assembly technology
Publication date
2017-05-30
Status
Effective
International Relationship
Cross references
Latest version
IEC 61191-3 Ed. 2.0 b:2017
Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies
Document identifier IEC 61191-3 Ed. 2.0 b:2017
Publication date 2017-05-30
Classification 31.240. Mechanical structures for electronic equipment
Status Effective
*
History of version
IEC 61191-3 Ed. 2.0 b:2017 * IEC 61191-3 Ed. 2.0 en:2017 * IEC 61191-3 Ed. 1.0 b:1998
Keywords
Classification
31.240. Mechanical structures for electronic equipment
Pages
40
Price 117 vnd

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