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Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies
Pages: 40
Publication date: 2017-05-30
Price: 117 vnd
Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies | |
Document identifier | IEC 61191-3 Ed. 2.0 b:2017 |
Publication date | 2017-05-30 |
Classification | 31.240. Mechanical structures for electronic equipment |
Status | Effective |