The purpose of this document is to provide manufacturers and users with standardized methods for handling, packing, shipping, and use of moisture/reflow and process sensitive devices that have been classified to the levels defined in J-STD-020 or J-STD-075. These methods are provided to avoid damage from moisture absorption and exposure to solder reflow temperatures that can result in yield and reliability degradation. By using these procedures, safe and damage-free reflow can be achieved. The dry-packing process defined herein provides a minimum shelf life of 12 months from the seal date.
Document identifier
JEDEC J-STD-033D
Title
Handling, Packing, Shipping, and Use of Moisture/Reflow Sensitive Surface-Mount Devices
JEDEC Category
JC-14.1: Reliability Test Methods for Packaged Devices
Publication date
2018-04-01
International Relationship
History of version
JEDEC J-STD-033D * JEDEC JEP113-B
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