Loading data. Please wait

Search standard  
Advanced search

IPC 7094A

Design and Assembly Process Implementation for Flip Chip and Die-Size Components

Pages: 96
Publication date: 2018-01-01
Price: 168 vnd

Add to cart
IPC 7094A describes the design and assembly challenges for implementing flip chip technology in a direct chip attach (DCA) assembly. The effect of bare-die or die-size components in a flip chip format has an impact on component characteristics and dictates the appropriate assembly methodology. This standard focuses on design, assembly methodology, critical inspection, repair and reliability issues associated with flip chip and die-size package technologies, including wafer-level ball grid array (WLBGA).
Document identifier
IPC 7094A
Title
Design and Assembly Process Implementation for Flip Chip and Die-Size Components
IPC Category
Design
Publication date
2018-01-01
Status
Effective
International Relationship
Cross references
Latest version
IPC 7094A
Design and Assembly Process Implementation for Flip Chip and Die-Size Components
Document identifier IPC 7094A
Publication date 2018-01-01
Classification
Status Effective
*
History of version
IPC 7094A * IPC 7094
Keywords
Classification
Pages
96
Price 168 vnd

POPULAR PUBLISHERS | ALL PUBLISHERS