This test method provides various tests for determining the integrity lead/package interface and the lead itself when the lead(s) are bent due to faulty board assembly followed by rework of the part for reassembly. For hermetic packages it is recommend that this test be followed by hermeticity tests in accordance with Test Method A109 to determine if there are any adverse effects from the stresses applied to the seals as well as to the leads. These tests, including each of its test conditions, is considered destructive and is only recommended for qualification testing. This test is applicable to all through-hole devices and surface-mount devices requiring lead forming by the user.
Document identifier
JEDEC JESD22-B105E
JEDEC Category
JC-64: Embedded Memory Storage and Removable Memory Cards
Publication date
2018-02-01
International Relationship
History of version
JEDEC JESD22-B105E * JEDEC JESD22-B105D
| Price |
62 vnd |
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