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JEDEC JESD51-4A

Thermal Test Chip Guideline (Wire Bond Type Chip)

Pages: 26
Publication date: 2019-06-01
Price: 67 vnd

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The purpose of this document is to provide a design guideline for thermal test chips used for integrated circuit (IC) and transistor package thermal characterization and investigations. The intent of this guideline is to minimize the differences in data gathered due to nonstandard test chips and to provide a well-defined reference for thermal investigations.
Document identifier
JEDEC JESD51-4A
Title
Thermal Test Chip Guideline (Wire Bond Type Chip)
JEDEC Category
JC-15.1: Inactive
Publication date
2019-06-01
Status
Effective
International Relationship
Cross references
Latest version
JEDEC JESD51-4A
Thermal Test Chip Guideline (Wire Bond Type Chip)
Document identifier JEDEC JESD51-4A
Publication date 2019-06-01
Classification
Status Effective
*
History of version
JEDEC JESD51-4A * JEDEC JESD51-4
Keywords
Classification
Pages
26
Price 67 vnd

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