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JEDEC JESD217

TEST METHODS TO CHARACTERIZE VOIDING IN PRE-SMT BALL GRID ARRAY PACKAGES

Pages: 44
Publication date: 2010-09-01
Price: 80 vnd

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This publication provides an overview of solder void types, outlines current metrologies and test methods used for pre-SMPT solder void characterization and potential limitations, and prescribes sampling strategy for data collection, and tolerance guidelines for corrective measures.
Document identifier
JEDEC JESD217
Title
TEST METHODS TO CHARACTERIZE VOIDING IN PRE-SMT BALL GRID ARRAY PACKAGES
JEDEC Category
JC-14: Quality and Reliability of Solid State Products
Publication date
2010-09-01
Status
Ineffective
International Relationship
Cross references
Latest version
JEDEC JESD217.01
TEST METHODS TO CHARACTERIZE VOIDING IN PRE-SMT BALL GRID ARRAY PACKAGES
Document identifier JEDEC JESD217.01
Publication date 2016-10-01
Classification
Status Effective
*
History of version
JEDEC JESD217.01*JEDEC JESD217 * JEDEC JESD217.01 * JEDEC JESD217
Keywords
Classification
Pages
44
Price 80 vnd

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