The IPC-7095D-AM1 standard describes design and assembly implementation for ball grid array (BGA) and fine-pitch BGA (FBGA) technology, focusing on inspection, repair and reliability issues associated with design and assembly of printed boards using these packages. IPC-7095D-AM1 provides the useful and practical information to those who use or are considering using BGAs. IPC-7095D-AM1 provides descriptions on how to successfully implement robust design and assembly processes for printed board assemblies using BGAs as well as ways to troubleshoot some common anomalies which can occur during BGA assembly.
Document identifier
IPC 7095D-WAM1
Title
Design and Assembly Process Implementation for BGAs, with Amendment 1
IPC Category
General, Electronics Assembly
Publication date
2019-06-01
International Relationship
History of version
IPC 7095D-WAM1 * IPC 7095D * IPC 7095C * IPC 7095B * IPC 7095A
| Price |
168 vnd |
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