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IEC 60191-6-12 Ed. 2.0 b:2011

Mechanical standardization of semiconductor devices - Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guidelines for fine-pitch land grid array (FLGA)

Pages: 37
Publication date: 2011-06-08
Price: 117 vnd

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IEC 60191-6-12:2011 provides standard outline drawings, dimensions, and recommended variations for all fine-pitch land grid array packages (FLGA) with terminal pitch of 0,8 mm or less. This edition includes the following significant changes with respect to the previous edition: - scope is expanded so that this standard include the square type FLGA. The title of this standard has been changed accordingly: "Rectangular type" has been deleted from the title; - ball pitch of 0,3 mm has been added; - datum is changed from the body datum to the ball datum; - combination lists of D, E, MD, and ME have been revised.
Document identifier
IEC 60191-6-12 Ed. 2.0 b:2011
Title
Mechanical standardization of semiconductor devices - Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guidelines for fine-pitch land grid array (FLGA)
IEC Category
SC 47D: Mechanical standardization for semiconductor devices
Publication date
2011-06-08
Status
Effective
International Relationship
Cross references
Latest version
IEC 60191-6-12 Ed. 2.0 b:2011
Mechanical standardization of semiconductor devices - Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guidelines for fine-pitch land grid array (FLGA)
Document identifier IEC 60191-6-12 Ed. 2.0 b:2011
Publication date 2011-06-08
Classification 31.080.01. Semiconductor devices in general
Status Effective
*
History of version
IEC 60191-6-12 Ed. 2.0 b:2011 * IEC 60191-6-12 Ed. 1.0 en:2002
Keywords
Classification
31.080.01. Semiconductor devices in general
Pages
37
Price 117 vnd

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