Device and Subassembly Mechanical Shock Test Method is intended to evaluate devices in the free state and assembled to printed wiring boards for use in electrical equipment. The method is intended to determine the compatibility of devices and subassemblies to withstand moderately severe shocks. The use of subassemblies is a means to test devices in usage conditions as assembled to printed wiring boards. Mechanical Shock due to suddenly applied forces, or abrupt change in motion produced by handling, transportation or field operation may disturb operating characteristics, particularly if the shock pulses are repetitive. This is a destructive test intended for device qualification. This document also replaces JESD22-B104.
Document identifier
JEDEC JESD22-B110B.01
Title
Mechanical Shock - Device and Subassembly
JEDEC Category
JC-14.1: Reliability Test Methods for Packaged Devices
Publication date
2019-06-01
International Relationship
History of version
JEDEC JESD22-B110B.01 * JEDEC JESD22-B110B * JEDEC JESD22-B104C (R2009) * JEDEC JESD 22-B110A (R2009)
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