JC-13.2: Microelectronic Devices

JC-13.4: Radiation Hardness: Assurance and Characterization

JC-13.5: Hybrid, RF/Microwave, and MCM Technology

JC-13: Government Liason in General

JC-14.1: Reliability Test Methods for Packaged Devices

JC-14.2: Wafer-Level Reliability

JC-14.3: Silicon Devices Reliability Qualification and Monitoring

JC-14.4: Quality Processes and Methods

JC-14.6: Failure Analysis (Inactive)

JC-14.7: Gallium Arsenide Reliability and Quality Standards

JC-14: Quality and Reliability of Solid State Products in General

JC-15.1: Inactive

JC-15.2: Inactive

JC-15: Thermal Characterization/Packages in General

JC-16.2: Inactive

JC-16: Interface Technology in General

JC-22.1: Inactive

JC-22.2: Rectifiers, Zeners and Signal Diodes

JC-22.4: Rectifiers, Zeners and Signal Diodes

JC-22.5: Transient Voltage Suppressors

JC-40.1: Digital Logic Families and Applications

JC-40.3: RDIMM Support Components

JC-40.4: FBDIMM Support Components

JC-40.5: Logic Validation and Verification

JC-40: Digital Logic in General

JC-42.1: Inactive

JC-42.3: DRAM Memories

JC-42.4: Non-Volatile Memory Devices

JC-42.6: Low Power Memories

JC-45.1: Registered DRAM Modules

JC-45.4: Fully Buffered DRAM Modules

JC-64.1: Electrical Specifications and Command Protocols

JC-64.2: Form, Fit and Climactic/Environmental Methodologies

JC-64: Embedded Memory Storage and Removable Memory Cards in General