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JEDEC JESD213

STANDARD TEST METHOD UTILIZING X-RAY FLUORESCENCE (XRF) FOR ANALYZING COMPONENT FINISHES AND SOLDER ALLOYS TO DETERMINE TIN (Sn) - LEAD (Pb) CONTENT

Pages: 11
Publication date: 2010-03-01
Price: 53 vnd

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This document is intended to be used by Original Component Manufacturers who deliver electronic components and Original Equipment Manufacturers who are the platform system integrators. It is intended to be applied prior to delivery by the OCMs and may be used by OEM system engineers and procuring activities as well as U.S Government Department of Defense system engineers, procuring activities and repair centers. This Standard establishes the instrumentation, techniques, criteria, and methods to be utilized to quantify the amount of Lead (Pb) in Tin-Lead (Sn/Pb) alloys and electroplated finishes containing at least 3 weight percent (wt%) Lead (Pb) using X-Ray Fluorescence (XRF) equipment.
Document identifier
JEDEC JESD213
Title
STANDARD TEST METHOD UTILIZING X-RAY FLUORESCENCE (XRF) FOR ANALYZING COMPONENT FINISHES AND SOLDER ALLOYS TO DETERMINE TIN (Sn) - LEAD (Pb) CONTENT
JEDEC Category
JC-13: Government Liason
Publication date
2010-03-01
Status
Ineffective
International Relationship
Cross references
Latest version
JEDEC JESD213A
STANDARD TEST METHOD UTILIZING X-RAY FLUORESCENCE (XRF) FOR ANALYZING COMPONENT FINISHES AND SOLDER ALLOYS TO DETERMINE TIN (Sn) - LEAD (Pb) CONTENT
Document identifier JEDEC JESD213A
Publication date 2017-04-01
Classification
Status Effective
*
History of version
JEDEC JESD213A*JEDEC JESD213 * JEDEC JESD213A * JEDEC JESD213
Keywords
Classification
Pages
11
Price 53 vnd

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