Loading data. Please wait

Search standard  
Advanced search

IEC 60191-6-17 Ed. 1.0 b:2011

Mechanical standardization of semiconductor devices - Part 6-17: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for stacked packages - Fine-pitch ball grid array and fine-pitch land grid array (P-PFBGA and P-PFLGA)

Pages: 53
Publication date: 2011-01-27
Price: 199 vnd

Add to cart
IEC 60191-6-17:2011 provides outline drawings and dimensions for stacked packages and individual stackable packages in the form of FBGA or FLGA.
Document identifier
IEC 60191-6-17 Ed. 1.0 b:2011
Title
Mechanical standardization of semiconductor devices - Part 6-17: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for stacked packages - Fine-pitch ball grid array and fine-pitch land grid array (P-PFBGA and P-PFLGA)
IEC Category
SC 47D: Mechanical standardization for semiconductor devices
Publication date
2011-01-27
Status
Effective
International Relationship
Cross references
Latest version
History of version
Keywords
Classification
31.080.01. Semiconductor devices in general
Pages
53
Price 199 vnd

POPULAR PUBLISHERS | ALL PUBLISHERS