This inspection method is for product semiconductor wafers and dice prior to assembly. This test method defines the requirements to execute a standardized external visual inspection and is a non-invasive and nondestructive examination that can be used for qualification, quality monitoring, and lot acceptance.
Document identifier
JEDEC JESD22-B118
Title
SEMICONDUCTOR WAFER AND DIE BACKSIDE EXTERNAL VISUAL INSPECTION
JEDEC Category
JC-14: Quality and Reliability of Solid State Products
Publication date
2011-03-01
International Relationship
| Price |
59 vnd |
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