This standard covers the design of printed circuit boards (PCBs) used in the thermal characterization of Dual-Inline Packages (DIP) and Single-Inline Packages (SIP). It is intended to be used in conjunction with the JESD51 series of standards that cover the test methods and test environments. JESD51-10 was developed to give a figure-of-merit of thermal performance that allows for accurate comparisons of packages from different suppliers. It can be used to give a first order approximation of system performance and, in conjunction with the other JESD51 PCB standards, allows for comparisons of the various package families.
Document identifier
JEDEC JESD51-10
Title
TEST BOARDS FOR THROUGH-HOLE PERIMETER LEADED PACKAGE THERMAL MEASUREMENTS
JEDEC Category
JC-15.1: Inactive
Publication date
2000-07-01
International Relationship
| Price |
56 vnd |
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