Loading data. Please wait

Search standard  
Advanced search

IEC 60191-6-20 Ed. 1.0 b:2010

Mechanical standardization of semiconductor devices - Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ)

Pages: 21
Publication date: 2010-08-30
Price: 47 vnd

Add to cart
IEC 60191-6-20:2010 specifies methods to measure package dimensions of small outline J-lead-packages (SOJ), package outline form E in accordance with IEC 60191-4.
Document identifier
IEC 60191-6-20 Ed. 1.0 b:2010
Title
Mechanical standardization of semiconductor devices - Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ)
IEC Category
SC 47D: Mechanical standardization for semiconductor devices
Publication date
2010-08-30
Status
Effective
International Relationship
Cross references
Latest version
History of version
Keywords
Classification
31.080.01. Semiconductor devices in general
Pages
21
Price 47 vnd

POPULAR PUBLISHERS | ALL PUBLISHERS