This test is used to determine the effects of bias conditions and temperature on solid state devices over time. It simulates the devices' operating condition in an accelerated way, and is primarily for device qualification and reliability monitoring. A form of high temperature bias life using a short duration, popularly known as burn-in, may be used to screen for infant mortality related failures. The detailed use and application of burn-in is outside the scope of this document.
Document identifier
JEDEC JESD22-A108E
Title
TEMPERATURE, BIAS, AND OPERATING LIFE
JEDEC Category
JC-14.1: Reliability Test Methods for Packaged Devices
Publication date
2016-12-01
International Relationship
History of version
JEDEC JESD22-A108F*JEDEC JESD22-A108E * JEDEC JESD22-A108F * JEDEC JESD22-A108E * JEDEC JESD22-A108D * JEDEC JESD 22-A108C
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JEDEC JESD22-A108E
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