The IPC-7091 intends to provide useful and practical information to those who are designing, developing or using 3D-packaged semiconductor components or those who are considering 3D package implementation. The 3D semiconductor package may include multiple die elements?some homogeneous and some heterogeneous. The package may also include several discrete passive SMT devices, some of which are surface mounted and some of which are integrated (embedded) within the components? substrate structure.
Document identifier
IPC 7091
Title
Design and Assembly Process Implementation of 3D Components
IPC Category
Design, Electronics Assembly
Publication date
2017-06-01
International Relationship
| Price |
168 vnd |
.jpg){kind=logo}
---Logo.jpg){kind=logo}
.jpg){kind=logo}
-_-logo.png){kind=logo}
.jpg){kind=logo}
.png)
