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IEC 60191-6-21 Ed. 1.0 b:2010

Mechanical standardization of semiconductor devices - Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP)

Pages: 28
Publication date: 2010-08-30
Price: 82 vnd

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IEC 60191-6-21:2010 specifies methods to measure package dimensions of small outline packages (SOP), package outline form E in accordance to IEC 60191-4.
Document identifier
IEC 60191-6-21 Ed. 1.0 b:2010
Title
Mechanical standardization of semiconductor devices - Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP)
IEC Category
SC 47D: Mechanical standardization for semiconductor devices
Publication date
2010-08-30
Status
Effective
International Relationship
Cross references
Latest version
History of version
Keywords
Classification
31.080.01. Semiconductor devices in general
Pages
28
Price 82 vnd

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