Encapsulation, for the purpose of IPC 7621, is defined as a low pressure molded thermoplastic, e.g., polyamide, which
is brought to a liquid state and injection molded and (rather quickly) returned to a temperature below its melting point,
forming a durable yet pliable (rubbery-like) form. The desired performance characteristics of LPM encapsulation depend on
the application and must be considered when selecting material. Users are urged to consult material suppliers for detailed
technical data. This guide will aid the user in understanding the capabilities and limits of LPM using thermoplastics.
Document identifier
IPC 7621
Title
Guideline for Design, Material Selection and General Application of Encapsulation of Electronic Circuit Assembly by Low Pressure Molding with Thermoplastics
IPC Category
General, Electronics Assembly
Publication date
2018-01-01
International Relationship
| Price |
168 vnd |
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