This publication provides a guideline to suppliers of IC components with a template for documenting the numerical simulation assumptions. In addition this guideline also suggests a model environment to reference when comparing various packages or component suppliers. This publication should improve the communication between the package model suppliers. This publication should improve the communication between the package model supplier and the end user.
Document identifier
JEDEC JEP126
Title
GUIDELINE FOR DEVELOPING AND DOCUMENTING PACKAGE ELECTRICAL MODELS DERIVED FROM COMPUTATIONAL ANALYSIS
JEDEC Category
JC-15.2: Inactive
Publication date
1996-05-01
International Relationship
Price |
48 vnd |