The IPC/JEDEC-9301document is an effort to standardize and document some of the basic tenets of a typical Finite Element Analysis (FEA) model, as well as, to educate new designers (and in some cases even experienced designers) on the basic information and best practices that should be captured and provided to technical reviewers of the results of FEA data.
Document identifier
IPC 9301
Title
Numerical Analysis Guidelines for Microelectronics Packaging Design and Reliability
Publication date
2018-12-01
International Relationship
| Price |
160 vnd |
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