Amendment 1 - Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)

IEC 60068-2-58 Amd.1 Ed. 4.0 en:2017

Pages: 7
Publication date: 2017-07-28
Price: 23 vnd

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Details

Document identifier

IEC 60068-2-58 Amd.1 Ed. 4.0 en:2017

Title

Amendment 1 - Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)

IEC Category

TC 91: Electronics assembly technology

Publication date

2017-07-28

Status

Effective

International Relationship

Cross references

Latest version

History of version

Keywords

Classification

19.040. Environmental testing
31.190. Electronic component assemblies

Pages

Price 23 vnd

IEC 60068-2-58 Amd.1 Ed. 4.0 en:2017

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