IPC 2292 establishes specific requirements for the design of printed electronic applications and their forms of component
mounting and interconnecting structures on flexible substrates. Flexible substrates, as pertain to this standard, are materials or
devices which have some amount of flexibility or bendability (not rigid) but are not considered to be stretchable (e.g., fabrics,
textiles, stretchable polymers, etc.).
Document identifier
IPC 2292
Title
Design Standard for Printed Electronics on Flexible Substrates
Publication date
2018-03-01
International Relationship
| Price |
168 vnd |
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