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IEC 60191-4 Ed. 3.0 b:2013

Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages

Pages: 48
Publication date: 2013-10-10
Price: 164 vnd

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IEC 60191-4:2013 specifies a method for the designation of package outlines and for the classification of forms of package outlines for semiconductor devices and a systematic method for generating universal descriptive designators for semiconductor device packages. The descriptive designator provides a useful communication tool but has no implied control for assuring package interchangeability. This edition includes the following significant technical changes with respect to the previous edition: a) Material code "S" is added to indicate a silicon based package. b) Description of "WL" is added to be used for general use.
Document identifier
IEC 60191-4 Ed. 3.0 b:2013
Title
Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
IEC Category
SC 47D: Mechanical standardization for semiconductor devices
Publication date
2013-10-10
Status
Ineffective
International Relationship
Cross references
Latest version
IEC 60191-4 Ed. 3.1 b:2018
Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages CONSOLIDATED EDITION
Document identifier IEC 60191-4 Ed. 3.1 b:2018
Publication date 2018-03-27
Classification 31.080.01. Semiconductor devices in general
Status Effective
*
History of version
IEC 60191-4 Ed. 3.1 b:2018*IEC 60191-4 Ed. 3.0 b:2013 * IEC 60191-4 Ed. 3.1 b:2018 * IEC 60191-4 Ed. 3.0 b:2013
Keywords
Classification
31.080. Semiconductor devices
31.080.01. Semiconductor devices in general
Pages
48
Price 164 vnd

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