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JEDEC JESD59

BOND WIRE MODELING STANDARD

Pages: 16
Publication date: 1997-06-01
Price: 56 vnd

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This standard describes the modeling of a bond wire from an integrated circuit (IC) die to a package lead in a ball or wedge type wire bond configuration.
Document identifier
JEDEC JESD59
Title
BOND WIRE MODELING STANDARD
JEDEC Category
JC-15.2: Inactive
Publication date
1997-06-01
Status
Effective
International Relationship
Cross references
Latest version
History of version
Keywords
Classification
Pages
16
Price 56 vnd

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