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IEC 60191-6-22 Ed. 1.0 b:2012

Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FL

Pages: 34
Publication date: 2012-12-11
Price: 117 vnd

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IEC 60191-6-22:2012 provides the outline drawings and dimensions common to silicon-based package structures and materials of ball grid array packages (BGA) and land grid array packages (LGA).
Document identifier
IEC 60191-6-22 Ed. 1.0 b:2012
Title
Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FL
IEC Category
SC 47D: Mechanical standardization for semiconductor devices
Publication date
2012-12-11
Status
Effective
International Relationship
Cross references
Latest version
History of version
Keywords
Classification
31.080.01. Semiconductor devices in general
Pages
34
Price 117 vnd

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