ISO 9453:2006 specifies the requirements for chemical composition for the following families of soft solder alloys:tin-lead, with and without antimony, bismuth, cadmium, copper, and silver;tin-antimony;tin-bismuth;tin-copper, with and without silver;tin-indium, with and without silver and bismuth;tin-silver, with and without copper and bismuth;tin-zinc, with and without bismuth.ISO 9453:2006 also includes an indication of the forms generally available.
Document identifier
ISO 9453:2006
Title
Soft solder alloys - Chemical compositions and forms
ISO Category
TC 44/SC 12: Soldering materials
Publication date
2006-10-01
International Relationship
BS EN ISO 9453:2006
History of version
ISO 9453:2014*ISO 9453:2006 * ISO 9453:2014 * ISO 9453:2006 * ISO 9453:1990
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